在上周的ISSCC（國(guó)際固態(tài)電路會(huì)議）上，微軟發(fā)表了名為“ Xbox Series X SoC”的演講，Anandtech進(jìn)行了跟蹤分析，https://www.anandtech.com/show/16489/xbox-series-x-soc-power-thermal-and-yield-tradeoffs

性能沒(méi)怎么提，來(lái)看看功耗發(fā)熱和噪音。

從微軟官方的熱成像圖來(lái)看，XSX的CPU比GPU發(fā)熱點(diǎn)高了7度，并且CPU發(fā)熱高度集中在內(nèi)核對(duì)應(yīng)的幾個(gè)小點(diǎn)上（7nm Zen2的積熱名不虛傳）。

回想馬克塞尼在技術(shù)直面會(huì)上說(shuō)的，PS5大幅拉高GPU頻率，除了性能和成本考慮，還可以均衡硅片的發(fā)熱，避免CPU那頭因熱密度太高積熱。

現(xiàn)在看看XSX這個(gè)SoC發(fā)熱情況，馬克塞尼果然是有道理的。

而在噪音的貢獻(xiàn)上，XSX的CPU每增加1W功耗，付出的噪音成本是GPU的五倍。（原文：every additional Watt the CPU uses is worth five times more to the acoustic budget than the GPU.）

（怎么越來(lái)越像是在替PS5說(shuō)話呢……）

人間迷惑之“微軟講自家產(chǎn)品設(shè)計(jì)，從頭到尾都像是在夸對(duì)手英明”。

—————————————————分? ? 割? ? 線—————————————————

微軟為實(shí)現(xiàn)12T浮點(diǎn)性能，測(cè)試了52CU@1.825GHz和56CU@1.675GHz兩個(gè)方案，測(cè)試結(jié)果是，52CU@1.825GHz的功耗比56CU@1.675GHz高20%，但鑒于保證56CU全好的生產(chǎn)難度帶來(lái)的良率成本，微軟最終選擇了52CU@1.825GHz。

原文：

Paul Paternoster explained that from chips coming off the production line, a substantial number could run with all 28 WGPs enabled. The goal of the graphics was to provide 12 TFLOPs of performance, and so by some simple math, Microsoft could do either of the following to hit that number:

• 28 WGPs enabled at 1675 MHz

• 26 WGPs enabled at 1825 MHz

Both of these configurations enable 12 TFLOPs. Because the frequency of the 28 WGP design is lower, this also enables a lower voltage, combined for an overall power saving of 20% if all 28 WGPs are used.

Of course, a 20% power saving is quite substantial, as it would either enable better performance per watt, or enable higher performance. But the issue is that not enough processors were coming off of the production line with all 28 WGP running at this frequency. The variability of the processors, due to both transistor performance and defects, meant that 28 WGP versions didn’t make sense financially.

從56CU@1.675GHz到52CU@1.825GHz，CU少了4個(gè)（少了7.7%），頻率提升150MHz（提升了9%），功耗就漲了20%？

微軟，你這能耗比真的是“真·RDNA2”嗎？